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High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP

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China Xiamen METS Industry & Trade Co., Ltd certification
China Xiamen METS Industry & Trade Co., Ltd certification
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Thank you for EMTS mould solutions,It save us so much work and save more cost,And thanks for kelly's hard work,kindly opinions.

—— Good quatity,Good service

Good help for EMTS give us so much suggestion for our productions and tooling solution.Let us know more about new tooling structure and how to run well .

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Dear Kelly, Michael needs a further uncoiler. Could you buy the same uncoiler as last time (PO-9827448) and ship it to us, please? Shipment should be by sea. Attached there is the order. Furthermore Michael asks for an other item, could you please check the price for

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High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP

High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP
High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP
High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP

Large Image :  High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP

Product Details:
Place of Origin: XIAMEN.CHINA
Brand Name: METS
Payment & Shipping Terms:
Minimum Order Quantity: 1 piece
Price: Negotiable
Packaging Details: PVC bag, wooden case,carton
Delivery Time: 5-20days
Payment Terms: TT,LC
Supply Ability: 1000000

High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP

Description
Type Of Die: Progressive Die Mould Life: 1000 Million Times Of Strokes
Press Force: 45Ton Tolerance: 0.2μm
Main Tooling Material: DC53,D2 Cavity: One Row
Thickness: 0.5mm Production Surface Treatment: Silver Plating
High Light:

led lead frame

,

ic lead frame

 

Progressive stamping die for high speed press semiconductor lead frame

 

TO,DIP,ZIP,SIP,SOP,SSOP,TSSOP

 

 

 

Lead frames are the metal structures inside a chip package that carry signals from the die to the outside.

Leadframe for a QFP package
The die inside the package is typically glued to the lead frame, and then bond wires attach the die pads to the leads. In the last stage of the manufacturing process, the lead frame is moulded in a plastic case, and outside of the lead frame is cut-off, separating all leads.

 

Progressive die for lead frame:
-- Discrete device lead frame dies: TO-92,TO-196,ITO-220,TO-252,TO-247,TO-3P etc.
-- IC lead frame dies:DIP-8L,DIP-16L,DIP-18L,DIP-28L,SOP-8L,SOP-16L,SOP-28L,SSOP-8L,SSOP-18L etc.
-- SMT lead frame dies: SOT-23,SOT-143 etc.

 

A. Material:0.2mm, 0.25mm, 0.3 mm thick brass, copper or stainless steel
B. Finishing:silver,gold ,palladium,tin ,nickel plated
C. Size: customized
D. Packing method: Polybag, carton box

 

Stamping Capability

A: The min. pitch: 0.5mm

B: Highest stamping speed: 600SPM/min or more

C: Precision: ±0.003mm

D: Rate of hole diameter and thickness 0.85:1

E: Stamping material thickness:0.05-2.0mm

F: zero or less loss of material use.

 

METS Precision-Tool uses a variety of 2D and 3D cad/cam Software to develop, design, and plan the layout of our dies. (see below for the full software list & details). We have the resources to build a die for any application. When high volumes of production are expected, we can build a dependable tool with longevity in mind. We can also produce low-cost tools for prototyping and sampling applications. Die protection is always on our mind, and DACO Precision-Tool can build in sensors that will help prevent costly damage to the die.

 

Tool&Die​ Profil

General Capabilities Design Modeling 2D, 3D,processing,assembling Die Location Technical Support Inspection
Detail Tooling Documentation DFMEA/PFMEA Quick Building Prototypes
Die Types Forming Dies Precision Progressive Stamping Dies Secondary Dies
High Speed Steel Stamping Dies Precision Blanking Dies Forming Die
Tooling Material Carbide(CD650,V3,KD20) ASP-23 ASP-60
S55C---45#55 AL7075 SKD11
Tooling Life 50 Million to 1000 Million Times
Die Concept 2-Plate Die 3-Plate Die Module Die
Production Equipment CNC SODICK Nice Surface EDM P/G
Drill SODICK Wire Cutting Machine J/G
Milling Machine WAIDA Profile Grinder Machine  
Stamping Equipment AIDA PURDER MICO
MICO    
Stamping Product Custom Stamping SIM shrapnel Spring clip
Battery shrapnel Shield Drawing Press-Fit Terminal
Lead Frame Power Contact Terminal PC Terminal parts
Additional Services Provided Custom Packing Packaging Heat Treat
Plating    
Delivery 3-5 Week 3-6 Week 4-7 Week

 

We accept your any request on shipment.By air, by sea,and by Express are acceptable.

  By Express By Air By Sea
West Europe 3-5 days 4-6 days 22-30days
USA &Canada 3-4days 5-6 days 16-27days
South Asia 3-5 days 3-7 days 12-20 days
Japan&South Korea 2-3 days 3-4 days 10-13 days
Russia -------- --------- 30-40 days
 

 

Packing:

First Step Wrapping by PE film to anti-rust.

Second wooden case without need of fumigation.Or as your required.

 

 

FAQ

Q: What’s your manufacture capability?
---- We use Sodick/Charmilles to frabricate die inserts,dimension we can do is +/-0.002mm.

Q: Can you make all the dimensions are according to our design/samples?
---- We can guarantee that all the dimensions are made according to your drawing/sample.Please notice that dimension tolerence we can do is +/-0.003mm.

Q: Did the stamping die suit for my press machine?
--- The stamping die is made according to your press machine’s specification.Before start making die parts,we will send the design for your approval.

Q: What’s your advantage compare with other supplier’s on the market?
---- We are stamping factory,have a team contains die design,making,maintance and stamping production.We know how important the good mold for stamping production.

---- All our engineers are with more than 10 years working experience.They are more professional on precision stamping field.

---- All the die parts we made are by Slow-speed wire EDM,can gurantee the dimension.Many of them make it by middle-speed wire EDM/fast-speed wire EDM

 

Stamping die Shows:

High Speed Press Semiconductor Stamped Lead Frame TO DIP ZIP SIP SOP SSOP TSSOP 0

 

 

Contact Details
Xiamen METS Industry & Trade Co., Ltd

Contact Person: kelly

Tel: +8613860452810

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